キャピラリおよびそれを用いたワイヤボンディング方法ならびに装置および半導体装置の製造方法

Capillary, wire bonding method and apparatus using the same, and manufacture thereof

Abstract

(57)【要約】 【課題】 ワイヤボンディングにおけるボンディングの 接合強度の向上および製造コストの低減を図る。 【解決手段】 内部にワイヤ案内孔3cが形成されると ともに、ボンディング時にワイヤのワイヤ接合部を加圧 する先端面3aに溝部3bが形成されたキャピラリ3 と、キャピラリ3に超音波振動を印加するUSホーン と、キャピラリ3によってワイヤボンディングが行われ るボンディング処理部とを有し、キャピラリ3により前 記ワイヤ接合部を加圧してワイヤボンディングを行う際 に、キャピラリ3の先端面3aに形成された溝部3bに より、キャピラリ3と前記ワイヤ接合部との接触抵抗を 増加させて前記ワイヤ接合部の加圧を行う。
PROBLEM TO BE SOLVED: To increase bonding strength of bonding and reduce a manufacturing cost, in wire bonding. SOLUTION: This wire bonding equipment is provided with a capillary 3 where a wire guide hole 3c is formed in the inside, and a trench part 3b is formed in the tip surface 3a which presses a wire bonding part of a wire at the time of bonding, an US horn applying ultrasonic vibration to the capillary 3, and a bonding treatment part where wire bonding is performed by the capillary 3. When wire bonding is performed by pressing the wire bonding part with the capillary 3, contact resistance between the capillary 3 and the wire bonding part is increased with the trench part 3b formed in the tip surface 3a of the capillary 3, and pressing of the wire bonding part is performed. COPYRIGHT: (C)2000,JPO

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Cited By (4)

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    US-7144755-B2December 05, 2006Renesas Technology Corp., Eastern Japan Semiconductor Technologies, Inc.Fabrication method of semiconductor integrated circuit device
    US-7765678-B2August 03, 2010Tdk CorporationMethod of bonding metal ball for magnetic head assembly
    US-7918378-B1April 05, 2011National Semiconductor CorporationWire bonding deflector for a wire bonder
    US-8267303-B2September 18, 2012National Semiconductor CorporationWire bonding apparatus with a textured capillary surface enabling high-speed wedge bonding of wire bonds